For use with lead & lead free wave soldering machines.

$older-$aver offers companies wave soldering the opportunity to instantly recycle dross created in the wave solder pot, thereby saving up to 50% in solder bar purchases.

How $older-$aver works
Hot dross is scooped up from the surface of the wave solder pot by the hand held, light weight $older-$aver. Instantly, $older-$aver separates the dross oxides from the solder in its unique high-speed rotary process system. The solder in the dross amalgam rapidly flows back into the wave solder pot whilst the oxide powder free flows out easy collection and safe disposal. $older-$aver works on a continuous process basis which means no lengthy and costly operator delays whilst the recycling operation takes place. Typically the complete process is as fast as any conventional de-drossing operation but with the added advantage of reduced handling of toxic and weighty materials.

Z-CHECK 600-L is a highly accurate, non-contact, double lazer inspection and measurement system designed for measuring wet or dry solder paste deposits, adhesive (glue), stencil aperture inspection, component placement, and a wide range of related electronics assembly applications. The system can be used to inspect and analyse up to ten separate production lines each with ten different products. Data and SPC reports can be viewed in either Excel or Note pad.

Z-CHECK 600 is a highly accurate, non contact, white light source inspection and measurement system designed for measuring wet or dry solder paste deposits, adhesive (glue), stencil aperture inspection, component placement, and a wide range of related electronics assembly applications. The system can be used to inspect and analyse up to ten separate production lines each with ten different products. Data and SPC reports can be viewed in either Excel or Note pad.

Z-CHECK 600 has a fixed lens of 50x magnification, allowing easy inspection of subjects. The machine comes with a Mag-Lok electrically controlled glide stage which allows fast & accurate positioning of the subject under the camera.

Z-CHECK 500 is the low cost entry level, non-contact thickness measuring instrument for the fast accurate measurement of Solder Paste. Adhesive (Glue), Components and Leads. The high precision measuring mechanism, with a measuring range of 10mm, is securing mounted on a robust, large granite base, making Z-CHECK 500 ideally suitable in any production or laboratory environment.

Z-CHECK 500 works by differentially focusing between the sample substrate and the top of the sample being measured, i.e. solder pad. Operator error is removed by a unique optical sighting system. A micro-slit of white light is projected onto the sample surface from an acute angle. When this is coincident with a central graticule on the monitor, the subject is in focus. When the sample is moved, the light slit also moves laterally and bringing this back to coincide with the graricule, refocused the instrument.

The distance moved by the microscope in refocusing, is the difference in height between the first and second position, and is displayed on the instrument. In this way varying interpretations by different operators on micro slit of light and surface illumination can be individually adjusted to suit any surface condition.

Z-CHECK 700 S (S.P.I.D.A.) is a highly accurate, non contact , inspection and measurement system designed for measuring wet or dry solder paste deposits, adhesive (glue), stencil aperture inspection, component placement and a wide range of related electronic assembly applications. The system can be used to inspect and analyse up to ten separate production lines with ten different products being produced on them. Data and SPC reports can be viewed in either Excel or Note pad.

Z-CHECK 700 S has a zoom lens with five stop positions giving a range from X30 to X160, allowing easy inspection of subjects having varying sizes.

The machine is supplied with a Mag-Lok glide stage which allows speedy positioning of the subject under the camera.

Operation of the Z-CHECK 700 S system is fast and very user-friendly. To measure a solder paste deposit, the operator places the subject onto the Mag-Lok glide table and positions the subject into view on the monitor, assisted by a Lazer pointer.